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Assembly Process Sr. Technician – Laser Marking

NQR Code:QG-05-TL-02955-2024-V1-TSSC

  • Old Code: QG-05-TL-02955-2024-V1-TSSC

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About this Qualification

Job Description

The individual for this job role is tasked with operating laser machines to accurately etch identification marks on semiconductor wafers. The individual is also responsible to set up laser parameters, ensuring the precision of markings, and maintaining equipment. In addition, he also need to inspect marked wafers for quality and adherence to specifications, documenting the process and outcomes.

Eligibility Criteria

Criteria 1 Criteria 2 Experience Training Qualification
Completed 2nd year of 3-year/ 4-years UG Completed No Experience None
2 year Diploma after 12th Completed No Experience None
12th Completed 3 years None
Previous NSQF qualification of Level 4.5 1.5 Years None

Progression Pathway

  • Assembly Process Supervisor – Wafer Dicing (Level-5.5)

Learning Module In Job Role/Qualifcation

National Occupation Standards (NOS)/Module NOS Code Mandatory/ Optional Estimated size (Hours) Nos Credit Level
Operate Laser Marking Machine for Semiconductor Wafers TEL/N7208 Mandatory 150 5 5
Maintain Laser Marking Equipment TEL/N7209 Mandatory 150 5 5
Quality Assurance of Laser-Marked Semiconductor Wafers TEL/N7210 Mandatory 90 3 5
Document Laser Marking Process TEL/N7211 Mandatory 90 3 5
Employability Skills DGT/VSQ/N0102 Mandatory 60 2 3